M45 PHASE CHANGE THERMAL INTERFACE FILM

M45 Phase Change Thermal Interface Film

M45 is a free standing 45C phase change thermal film designed to provide high performance heat transfer for a variety of power module packages, LED assemblies, CPU/Sink or any demanding electronics cooling application where efficient and reliable heat transfer is required. Available standard as either a 5 mil, 8 mil or 12 mil thick free standing phase change film in either sheet or die cut format. Upon initial phase change, M45 begins its controlled flow from its original pre-formed die cut size adjusting for surface irregularities and flatness conditions leading to improved thermal performance. This also includes a reduction of the bond line thickness as mounting pressures are increased.
M45 Film Features and Benefits
  • Thermal conductivity - 5.0 W/m-K
  • 45C phase change temperature
  • Low thermal impedance over a range of pressures
  • Uniform free standing film thickness
  • Thixotropic -silicone free compound design
  • Easy to apply | release liner tab system
  • Excellent replacement for thermal greases
  • Reworkable after phase change
  • Metal foil substrate coating optoins available
To request samples or technical data sheet, please click on thie link located to the right or call TF: 1-888-989-3832 (US) International: +1-949-369-7676.
request samples | data sheet

Material Thickness

  • M45-5 (0.13mm)
  • M45-8 (0.20mm)
  • M45-12 (0.30mm)
Format: Free standing phase change thermal inteface film with release liner.

Standard Cross Section

Typical Applications

General Specifications

  • Power Modules | IGBT
  • MOSFET
  • Memory Modules
  • CPU | Heat Sink Assembly
  • LED Assembly
  • Automotive Electronics
  • Consumer Electronics
  • Medical Device Electronics
  • Heat Pipe Assembly
  • Servo Drive Controls
  • Power Electronics
  • Phase Change Temperature: 45C
  • Thermal Conductivity: 5.5 W/m-K
  • Compound Flow Design: Thixotropic
  • Maximum Operating Temperature: 125C
  • Material Color: Gray
  • Material Surface: Slight Tack

Compliance

  • RoHs Compliant
  • REACH Compliant
  • Halogen Free Compliant

Release Liner | Thermal Pad Transfer System

When designing M45 to achieve excellent thermal transfer results, the thermal performance was not the only target. An additional key advantage in using M45 is the offering of the TIMTEL Die Cut Thermal Pad Transfer System. The purpose of this die cut design was to avoid common installation issues typically experienced by similar phase change thermal pads on the market place today such as not releasing properly from the liner and pad tearing.

Thermal Impedance

Thermal impedance testing performed per ASTM D5470 Test Method. Contact us for additional pressure range figures.
M45-5 (0.13mm)
20 PSI - 0.0114 oC-in^2/W 40 PSI - 0.0087 oC-in^2/W 80 PSI - 0.0070 oC-in^2/W
M45-8 (0.20mm)
20 PSI - 0.0118 oC-in^2/W40 PSI - 0.0093 oC-in^2/W80 PSI - 0.0076 oC-in^2/W
M45-12 (0.30mm)
20 PSI - 0.0124 oC-in^2/W40 PSI - 0.0100 oC-in^2/W80 PSI - 0.0082 oC-in^2/W

Other Information

Material Formats
Sheets Die cut invidiual pads Multiple die cut pads per master liner
Optional Substrate Coatings
Aluminum foil Copper foil Stainless steel foil Graphite heat spreader foil 100% surface or discrete placement
Storage | Shelf Life
Store material in a cool, dry location at 80F / 27C or below in original packaging until use. Shelf life is 1 year from date of manufacture.
Request Sample or Technical Data Sheet
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